TC74HC04AF

TC74HC04AF

Category: Elec-component Available (Qty:9999999)
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Description

BUY TC74HC04AF https://www.utsource.net/itm/p/1207735.html
High Speed CMOS Hex InverterCMOS

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 2.0 - 6.0 V -
Input Low Voltage VIL 0.3 - - V VCC = 4.5V to 5.5V
Input High Voltage VIH - - 2.0 V VCC = 4.5V to 5.5V
Output Low Voltage VOL 0.1 0.2 0.4 V IOL = 4mA, VCC = 4.5V to 5.5V
Output High Voltage VOH 2.4 2.7 3.4 V IOH = -0.4mA, VCC = 4.5V to 5.5V
Propagation Delay Time (Positive Edge) tpd(+) 8 - 22 ns VCC = 5V, TA = 25°C
Propagation Delay Time (Negative Edge) tpd(-) 8 - 22 ns VCC = 5V, TA = 25°C
Power Dissipation PD - - 100 mW Per Package
Operating Temperature Range TA -40 - 85 °C -
Storage Temperature Range TSTG -65 - 150 °C -

Instructions for Using the TC74HC04AF

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the range of 2.0V to 6.0V.
    • Connect the ground (GND) pin to the system ground.
  2. Input Signals:

    • Apply input signals within the specified voltage levels:
      • Low input (VIL): 0.3V or lower when VCC is between 4.5V and 5.5V.
      • High input (VIH): 2.0V or higher when VCC is between 4.5V and 5.5V.
  3. Output Signals:

    • The output low voltage (VOL) should be 0.4V or lower when sourcing 4mA.
    • The output high voltage (VOH) should be 2.4V or higher when sinking -0.4mA.
  4. Propagation Delay:

    • The propagation delay time (tpd) for both positive and negative edges is typically between 8ns and 22ns at VCC = 5V and TA = 25°C.
  5. Temperature Considerations:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  6. Power Dissipation:

    • Ensure that the power dissipation per package does not exceed 100mW.
  7. Handling:

    • Handle the device with care to avoid static damage.
    • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.
  8. Mounting:

    • Mount the device on a PCB using standard surface mount technology (SMT) procedures.
    • Ensure proper soldering and avoid excessive heat during soldering.

By following these parameters and instructions, you can ensure reliable operation of the TC74HC04AF in your application.

(For reference only)

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