Phenom Pharos G2 Desktop FEG-SEM
Bringing field emission SEM to your tabletop — outperforming many floor-standing SEMs in image quality while delivering a vastly better user experience. FEG performance for everyone, accessible in one hour of training.
Product Overview
The Phenom Pharos G2 Desktop FEG-SEM makes FEG performance accessible for academic and industrial laboratories. Sample loading takes under 30 seconds to an SEM image, and the intuitive interface means master students, visitors, and researchers not trained on high-end FEG SEMs can produce stunning results immediately. The new G2 expands the Pharos line down to 1 kV for beam-sensitive and insulating samples and up to 20 kV for finest detail resolution — eliminating the need for external service labs or central facilities.
Main Features & Capabilities
Long-Lifetime Schottky FEG Source
Field emission tip lifetime exceeding 10,000 hours — no regular downtime for source exchange. Delivers a stable, high-brightness beam for consistent results.
2.0 nm Resolution at 20 kV
SE resolution of <2.0 nm at 20 kV and 3 nm BSE. At 3 kV, 10 nm SE resolution enables imaging of beam-sensitive samples at low voltage.
Extended Voltage Range: 1–20 kV
New G2 expansion down to 1 kV allows imaging of insulating samples and beam-sensitive materials (e.g., polymers, pharmaceuticals) without conductive coating.
Blazing Fast Sample Loading
Optical image available in under 5 seconds. SEM image ready in under 30 seconds.
Embedded EDS Elemental Analysis
25 mm² SDD with ultra-thin SiNx window detects elements B to Cf. Fully embedded — no external digital beam control. Auto-peak ID and iterative strip peak deconvolution with one-click DOCX report export.
Integrated Low/Medium/High Vacuum Modes
Three selectable vacuum modes built in. Diaphragm vacuum pump included in system kit — no external infrastructure required beyond a regular power outlet.
Description & Key Benefits
Fast Sample Exchange: Optical image in <5 s and SEM image in <30 s enable rapid workflow. The system serves well as a walk-up tool, boosting lab throughput without scheduling constraints.
Low-Voltage Imaging: Acceleration voltage down to 1 kV eliminates the need for coating on insulating or beam-sensitive samples. Nanoscale surface features remain unobscured, enabling true surface morphology analysis.
All-Inclusive Kit: System ships with imaging module, 24" monitor, keyboard, mouse, diaphragm vacuum pump, and UPS power supply. Initialization starts automatically on power-on — no complex commissioning procedures.
Diverse Sample Holders: Holders for resin mounts, 1.0" core plugs, micro tools, tilt-rotation, temperature control, motorized tilt & rotation, and electrical feedthrough. Optional sample sizes available.
System Specifications
| Imaging | |
| Electron Source | Schottky Field Emission, >10,000 hours lifetime |
| Acceleration Voltage | 1–20 kV |
| Resolution (SE) at 20 kV | <2.0 nm |
| Resolution (BSE) at 20 kV | 3 nm |
| Resolution (SE) at 3 kV | 10 nm |
| Maximum Magnification | 2,000,000× |
| Detection & Vacuum | |
| Standard Detector | High-sensitivity BSE detector (multi-mode) |
| Optional Detector | Everhart-Thornley Secondary Electron Detector (SED) |
| Vacuum Modes | Integrated low / medium / high vacuum |
| Sample Handling | |
| Loading Time (Optical) | <5 s |
| Loading Time (Electron Optical) | <30 s |
| EDS Elemental Analysis (Optional) | |
| Detector Type | Silicon Drift Detector (SDD) |
| Active Area | 25 mm² |
| X-ray Window | Ultra-thin SiNx — elements B to Cf |
| Energy Resolution | Mn Kα ≤132 eV |
| Max Input Count Rate | 300,000 cps |
| Processing Channels | Multi-channel analyzer, 2,048 ch at 10 eV/ch |
| Hardware Integration | Fully embedded, no external digital beam control |
| Site Requirements | |
| Temperature | 15°C – 30°C (59°F – 86°F) |
| Humidity | 20–80% RH |
| Power Supply | Single phase AC 100–240 V, 50/60 Hz, 400 W max |
| Recommended Table Size | 120×75 cm (47×29.5 in), load rating ≥150 kg |
| Max Operating Altitude | 2,000 m |
Versatile Applications
Nanomaterial Characterization
Gold nanoparticles, carbon nanotubes, silver nanostructures, and other nanomaterials imaged at <2.0 nm resolution with BSE or SE contrast to reveal size, shape, and surface morphology.
Thin Film & Coating Analysis
Line Scan EDS reveals quantified elemental profiles across multilayer coatings, paints, and thin film stacks — essential for quality control in manufacturing and research.
Polymer & Insulating Materials
Low-voltage imaging (down to 1 kV) eliminates charging artifacts on polymers and insulators without the need for conductive coatings, preserving true surface features.
Pharmaceutical Research
Powder morphology and particle size analysis at 1 kV without beam damage. Ideal for characterizing active pharmaceutical ingredients and excipient particles safely.
Microelectronics & Failure Analysis
Dedicated micro-electronics and X-view inserts enable inspection of PCBs, semiconductor structures, and small components. High-resolution BSE imaging reveals subsurface contrast.
Materials Science & Academia
Walk-up access model ideal for university labs. Students and visiting researchers operate independently after 1-hour training. 3D roughness reconstruction and particle/fiber/pore analysis software available as optional add-ons.
Particle & Fiber Analysis
Automated particle and fiber characterization using optional ParticleMetric and FiberMetric software. Statistically significant population analysis with size, shape, and elemental composition data for quality assurance workflows.
3D Surface Roughness
Optional 3D roughness reconstruction software generates quantitative surface topography from SEM images. Enables surface finish analysis and quality control for precision-manufactured components without a dedicated profilometer.
