Mainly designed for semiconductor integrated circuit IC packaging and LED bracket cleaning processes
Can clean four different widths of products simultaneously, and the number oftracks can be increased or decreased
Adjustable track width, compatible with products of different specifications and sizes, and independent sheet cleaning greatly improves cleaning uniformity
Automatic transmission of lead frame, automatic return to the material box after cleaning, full automation, no contactreduce the risk of secondary pollution
Proprietary discharge structure and gas path design greatly improve the eficiency and uniformity of plasma surface activation decontamination
