Semi-Automatic Wafer Mounting Machine

The Semi-Automatic Wafer Mounting Machine is a high-precision solution designed for mounting semiconductor wafers onto dicing tape frames prior to the dicing process. Widely used in semiconductor manufacturing, electronics production, and advanced packaging applications, this system ensures accurate lamination, strong adhesion, and reliable wafer handling. It plays a critical role in preparing wafers for cutting processes by securely attaching them to frames while maintaining surface integrity.

Equipped with automatic film feeding and lamination capabilities, the system delivers consistent and bubble-free tape application. Its semi-automatic configuration allows operators to maintain control during wafer loading and unloading, while benefiting from automation in key processes. Designed for flexibility, the machine supports multiple wafer sizes and can be adapted for specialized applications such as bump wafers, making it suitable for both production lines and R&D environments.

Key Features & Benefits

• Supports 8-inch and 12-inch wafers, customizable for 4-inch and 6-inch wafers
• Handles wafer thickness ≥ 100 µm for delicate wafer processing
• Compatible with Blue tape and UV dicing tape
• Automatic film feeding and lamination for consistent, high-quality results
• Ensures bubble-free and uniform tape application for reliable dicing performance
• Adaptable with special chuck for bump wafer applications
• Manual dicing tape cutting within the ring for process flexibility
• Manual blade cutting and film peeling for controlled operation
• Manual wafer and frame loading/unloading for precision handling
• Robust and stable design for long-term industrial reliability

Technical Specifications

Typical Applications

Why Choose a Semi-Auto Wafer Mounting Machine?

This system is essential for ensuring wafer stability and alignment during the dicing process. By providing precise lamination and secure attachment to frames, it minimizes wafer movement, reduces defects, and improves overall yield. Its semi-automatic design offers the ideal balance between operator control and process efficiency, making it a cost-effective solution for manufacturers seeking reliability and flexibility.

Get Started Today

Enhance your wafer preparation and dicing efficiency with our Semi-Automatic Wafer Mounting Machine. Contact us today to explore customization options and integrate this precision solution into your semiconductor manufacturing workflow.