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Product Summary |
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Atmosphere furnace with cleanliness level 100 and oxygen concentration below 20ppm, mainly used for curing semiconductor wafers. |
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Features |
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Maximum operating temperatures of 360℃ and 500℃, with cleanliness level 100 and oxygen concentration below 20ppm, primarily used for curing semiconductor wafers (photoresist PI, PBO curing), glass substrate baking, high-precision annealing, etc |
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Using a high-performance filter with high-temperature resistant, maintaining cleanliness level 100 inside the chamber, allowing for high-temperature baking in a clean environment |
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High gas-tightness pressure chamber construction, with short oxygen concentration reaching time and extremely low N2 consumption |
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Maintaining high gas-tightness through magnetic sealing and a watercooling mechanism to protect sealing components from thermal effects |
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Quick heating and cooling, with adjustable heating and cooling rates |
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Standard equipped with waste liquid recovery devices to cool and recover gases |
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Safety Equipped with door detection switch, overheating preventer, oxygen concentration abnormality, nitrogen pressure detection, nitrogen flow detection, cooling water flow detection, leakage sensor, overcurrent leakage protection and other devices |
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Specifications |
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Specification Item |
Details |
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Model |
DTN450C |
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System |
Nitrogen replacement + Forced convection |
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Operating temperature range |
Room temp.+50~500℃ |
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GB standard Temp. fluctuation |
±0.5℃ (at 500℃) |
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Average temp.deviation |
±1.5℃ (at 100℃)), ±2℃ (at 200℃), ±4℃ (at 300℃), ±5℃ (at 400℃),±8℃ (at 500℃)) |
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Temp. adjustment accuracy |
±0.5℃ (at 500℃) |
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Temp. distribution accuracy |
±8℃ (at 500℃) |
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Max. temp. reaching time |
Approx. 120 min |
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Oxygen concentration |
Below 20ppm |
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Oxygen concentration reaching time |
≤20 min (250L/min nitrogen) |
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Cleanliness |
Constant temperature maintained at level 100 |
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Exterior material |
Cold rolled steel plate with chemical proofing coating |
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Insulating material |
Aluminosilicate cotton |
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Heating method |
Stainless steel heating pipe Alloy heating wire |
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Heating power |
Main heater 10.8KW ,N2 preheating 1KW |
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Cooling mechanism |
Stainless steel cooling water heat exchanger |
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Temp. control method |
PID control |
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Temp. controller |
Liquid crystal touchscreen + PLC |
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Operation functions |
Manual fixed temp. operation, automatic program operation |
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Program mode |
9 program operations, each program can set 9 segments (expandable) |
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Additional functions |
Operator level certification |
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Heater |
circuit control SSR drive |
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Sensors |
K-type thermocouple (temperature control and overheating prevention) |
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Safety device |
Door detection switch, overheating preventer, oxygen concentration anomaly, overheating of N2 preheating, low water pressure detection, low N2 pressure detection, cooling water flow detection, N2 flow detection, fan overload detection, overcurrent leakage protection, etc. |
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Internal dimensions |
450×450×450 |
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External dimensions (W×D×H mm) |
1090×1170×1570 |
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Internal capacity |
91L |
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Shelf layer/spacing |
12 layers/30mm 19 |
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Exhaust vent |
KF40 |
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Nitrogen inlet |
Rc1/2 |
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Cooling water inlet |
Rc3/4 |
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Hot water outlet |
Rc3/4, 2 pcs |
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Power Source |
3 phase AC380V 20A |
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Weight |
Approx. 900kg |
Malaysia
