This is a polished and professionally formatted version of your technical specifications for OS Electronics. I have corrected the grammar, standardized the terminology, and improved the readability for a global B2B audience.
| Feature | Specification |
| Maximum Board Size (X x Y) | 530mm x 510mm |
| Minimum Board Size (X x Y) | 50mm x 50mm |
| PCB Thickness | 0.4mm – 6mm |
| Warpage | ≤ 1% (Diagonal) |
| Maximum Board Weight | 5kg |
| Board Margin Gap | Configurable to 3mm |
| Maximum Bottom Clearance | 20mm |
| Transfer Speed | 1500mm/s (Max) |
| Transfer Height (from floor) | 900 ± 40mm |
| Transfer Direction | L-R, R-L, L-L, R-R |
| Transfer Mode | Single-stage conveyor |
| PCB Clamping Method |
Automatic thickness adjustment + Programmable elastic side clamps. (Options: Edge-locking plate; Bottom integral vacuum; Bottom multi-point local vacuum) |
| Support Method |
Magnetic thimbles, equal-height blocks, etc. (Options: Vacuum chamber; Special workpiece fixtures) |
| Feature | Specification |
| Print Head | Floating intelligent head (driven by two independent direct-connect motors) |
| Template Frame Size | 470mm x 370mm to 737mm x 737mm |
| Maximum Printing Area | 530mm x 510mm |
| Squeegee Type | Steel or Rubber (45°/50°/60° angles to match process) |
| Squeegee Length | 300mm standard (Optional: 200mm – 550mm) |
| Squeegee Height/Thickness | Height: 65 ± 1mm; Thickness: 0.25mm (Diamond-like Carbon coating) |
| Printing Mode | Single or double squeegee printing |
| Demolding / Stroke | Length: 0.02mm – 12mm; Stroke: ± 275mm (from center) |
| Speed & Pressure | Speed: 0 – 200mm/s; Pressure: 0.5kg – 10kg |
Cleaning System: Programmable fluid injection; Dry, Wet, and Vacuum modes. (Wiping board: 300mm+510mm).
Field of View: 8mm x 6mm.
Platform Adjustment: X: ±5.0mm, Y: ±7.0mm, θ: ±2.0°.
Fiducial Types: Standard shapes (SMEMA), solder pads, or openings.
Camera System: Independent up/down vision system with geometric matching.
Repeatability: * Image Calibration: ±10.0μm @ 6σ, Cpk ≥ 2.0.
Printing Precision: ±15.0μm @ 6σ, Cpk ≥ 2.0.
Cycle Time: < 7.5s (excluding printing and cleaning).
Product Changeover: < 5 minutes.
Features four adjustable light sources with uniform intensity for superior image acquisition. It provides excellent identification of uneven fiducials and supports various PCB finishes, including Copper, Gold plating, Tin spraying, and FPC in multiple colors.
The redesigned wiping system ensures full contact with the stencil. A high-capacity vacuum and anti-static rollers effectively eliminate solder paste residue from the mesh, ensuring a truly automated and reliable cleaning process.
The squeegee Y-axis utilizes a servo motor with a screw drive for higher accuracy, smoother operation, and an extended service life, providing a stable control platform.
Programmable settings with two independent direct-drive motors. Features a built-in "zero-pressure" detection system for precise application.
The platform height automatically calibrates based on the PCB thickness setting. This structure is designed to be intelligent, fast, and highly reliable.
The 2D function quickly detects offsets, insufficient tin, bridging, and leakage. Integrated SPC software analyzes CPK indices to ensure consistent printing quality.
Automatic Solder Paste Replenishment: Real-time monitoring of paste roll diameter. Automatically adds paste at fixed intervals to ensure consistent volume and quality.
Stencil Mesh Inspection: Uses an overhead light source and CCD camera to check for blockages in the stencil mesh in real-time, supplementing the 2D PCB inspection.
Closed-Loop Squeegee Pressure Control: Integrated digital sensors monitor and adjust squeegee depth and pressure in real-time to maintain constant values for fine-pitch devices.
Environmental Control: Automatic regulation of temperature and humidity within the machine to stabilize the physical characteristics of the solder paste.
MES System Integration: Seamlessly scans 1D/2D codes to share data with the customer's MES for full traceability, material management, and quality control.
SPI Closed-Loop Interface: Connects with Solder Paste Inspection (SPI) systems to automatically adjust XY offsets (within 3 pulses) and trigger cleaning cycles based on defect feedback.
Automatic Dispensing: Enables accurate tin dispensing or line drawing directly on the PCB after the printing process.
| Item | Function |
| 1 | Paste Roll Height Monitor (aPRHM) |
| 2 | Internal Work Area Temperature & Humidity Detection |
| 3 | Windows 10 Operating System |
| 4 | Upper Press Function (for board flatness) |
| 5 | Grid-Lock PCB Support System |
| 6 | Support Pin/Block Detection Sensors |
| 7 | 6oz Semko Cartridge Solder Paste Feed System |
| 8 | Touch Screen Monitor Control |
| 9 | Solid State Drive (SSD) Upgrade |
| 10 | Comprehensive Data Logging (Log export to Excel/Access, Remote Export, and Critical Value Alarms) |
| 11 | Uninterruptible Power Supply (UPS) |
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