The LKing Plus is a high-performance automatic solder paste printing machine specifically engineered for oversized PCB applications. It boasts an industry-leading printing area of up to 2000mm x 510mm, making it the ideal solution for large-scale electronics manufacturing, such as LED light bars and large-format backplanes.
| PCB Parameters | Specifications |
| Max Board Size (X x Y) | 2000mm x 510mm |
| Min Board Size (X x Y) | 80mm x 50mm |
| PCB Thickness | 0.8mm – 6mm (Sub-0.8mm requires stowage/carrier) |
| Max Warpage | 1% of the PCB diagonal |
| Max Board Weight | 10kg |
| Board Margin Gap | 4mm |
| Max Bottom Clearance | 20mm |
| Transfer Speed | 1200mm/s (Max) |
| Transfer Height | 900 ± 40mm |
| Transfer Direction | L-R, R-L, L-L, R-R |
| Clamping Method | Programmable flexible side pressure; Bottom integral suction cavity |
| Support Method | Magnetic thimble + Equal-height blocks (Optional: Vacuum suction or custom fixtures) |
| Printing Parameters | Specifications |
| Printing Head | Floating intelligent head (Driven by two independent direct-connected motors) |
| Template Frame Size | 737mm x 370mm to 1800mm x 737mm |
| Squeegee Type | Steel or Glue scraper (Angles: 45°/50°/60°) |
| Squeegee Length | 300mm (Optional: 200mm – 400mm) |
| Printing Speed | 0 – 200 mm/s |
| Printing Pressure | 0.5kg – 15kg |
User-Friendly Interface: Runs on a stable OS with an independently developed graphical Man-Machine Interface (MMI). Features include easy program navigation, bilingual (Chinese/English) switching, comprehensive fault self-diagnosis, and detailed operation logs.
Z-Axis Servo Direct Drive: The Z-axis utilizes a direct-connected servo screw device to ensure high precision, high speed, and maximum stability during the stripping/demoulding process.
Adaptive PCB Thickness System: A dedicated HTGD system that intelligently adjusts the clamping mechanism to match different PCB thicknesses quickly and reliably.
2D Inspection & SPC Analysis: Integrated 2D vision detects offsets, insufficient tin, missing prints, or bridging. The included SPC software analyzes the machine's CPK index to maintain consistent printing quality.
Automatic Solder Paste Replenishment: Real-time monitoring of solder paste roll diameter on the stencil; automatically triggers refills to ensure continuous, stable production.
Stencil Plugging Detection: Uses an upper light source and CCD camera to check the mesh in real-time, triggering automatic cleaning if a blockage is detected.
Closed-Loop Squeegee Pressure Control: Built-in digital pressure sensors provide real-time feedback and intelligent depth adjustment to ensure perfect consistency for high-density components.
Integrated Dispensing Function: Allows for accurate tin dispensing, line drawing, and filling operations immediately after the printing process.
MES & Industry 4.0 Integration: Seamlessly docks with factory MES systems via 1D/2D barcode scanning for full traceability, material management, and quality control.
SPI Closed-Loop Interface: Connects with Solder Paste Inspection (SPI) machines to automatically adjust XY offsets (within 3μm) based on real-time feedback.
| Item No. | Function / Feature |
| 1 | Paste Roll Height Monitor (aPRHM) |
| 2 | Internal Temperature & Humidity Detection |
| 3 | Windows 10 Operating System Upgrade |
| 4 | Grid-Lock PCB Support System |
| 5 | Cartridge-based Solder Paste Feeding (Semko 6 Oz) |
| 6 | SSD-equipped PC for faster data processing |
| 7 | Remote export of log files (Excel/Access compatible) |
| 8 | Uninterruptible Power Supply (UPS) |
Malaysia
