The NEO features a simple, reliable structure designed for high-end SMT applications, with a specific focus on Mini LED production. Engineered for accuracy and ease of adjustment, the NEO facilitates rapid, automatic PIN height adjustments for varying PCB thicknesses.
The advanced cleaning system utilizes a dedicated spray nozzle to distribute cleaning fluid evenly across the wiping paper. Combined with a soft, anti-wear, and anti-rust arc-shaped rubber wipe board, the system provides thorough bidirectional cleaning. It supports multiple modes, including dry, wet, vacuum, and reciprocating cleaning.
Alignment Precision: $\pm10.0\mu m @ 6\sigma, Cp \ge 2.0$
Printing Precision: $\pm15.0\mu m @ 6\sigma, Cp \ge 2.0$
| Category | Parameter | Specification |
| PCB Parameters | Max. Board Size ($X \times Y$) | 650mm x 610mm |
| Min. Board Size ($X \times Y$) | 50mm x 50mm | |
| PCB Thickness Range | 0.4mm – 6mm | |
| PCB Warpage | $\le 1\%$ Diagonal | |
| Max. Board Weight | 5kg | |
| Conveyor Speed | Max. 1500mm/s | |
| Conveyor Height | $900 \pm 40$mm | |
| Transport Direction | L-R, R-L, L-L, R-R | |
| Printing Parameters | Print Head | Servo motor-driven precision screw, suspended intelligent head |
| Stencil Frame Size | 470mm x 200mm to 800mm x 800mm | |
| Squeegee Pressure | 0.5kg – 10kg | |
| Print Speed | 0 – 200 mm/s | |
| Cleaning Modes | Dry, Wet, Vacuum (Programmable) | |
| Vision System | Field of View (FOV) | 8mm x 6mm |
| Fiducial Types | Circle, Triangle, Square, Diamond, Cross, Solder Pad | |
| Vision Methodology | Independent Up/Down imaging; geometric matching | |
| Facilities | Power Supply | AC 220V $\pm 10\%$, 50/60Hz, 15A |
| Air Supply | 4–6 kg/cm² | |
| Machine Weight | Approx. 1230kg |
High-Precision Optical Positioning: Features a four-way adjustable light source for uniform intensity and perfect image acquisition. It excels at identifying difficult marks on tin, copper, gold, or FPC surfaces.
Adaptive Stencil Cleaning: A high-efficiency system ensuring full contact with the stencil. Includes dry, wet, and vacuum modes that can be combined as needed.
Intelligent Squeegee System: Driven by two independent direct motors with built-in precise zero-pressure detection.
GDK Adaptive Thickness System: Automatically calibrates platform height based on programmed PCB thickness for fast, reliable transitions.
Servo-Driven Printing Axis: The Y-axis utilizes a servo motor and precision screw drive to ensure long-term operational stability and control.
2D Inspection & SPC Analysis: Quickly detects offsets, insufficient solder, bridging, and leakage. Integrated SPC software analyzes CPK indices to guarantee production quality.
Environmental Monitoring: Real-time monitoring of internal temperature and humidity to ensure the printing environment meets material requirements.
Industry 4.0 & MES Support: Automatically generates LOG files and integrates seamlessly with MES systems for full production traceability.
Automatic Solder Paste Filling: Ensures a constant volume of paste on the stencil for stable, continuous high-volume printing.
Automatic Dispensing Function: Enables precise dispensing, line drawing, and filling directly on the PCB according to process requirements.
Stencil Inspection System: Uses CCD technology to check for mesh blockages in real-time, complementing 2D PCB inspection.
Paste Height Monitor (aPRHM): Triggers automatic filling when paste levels drop, preventing defects due to insufficient solder.
Magnetic Squeegee: Features magnetic adsorption for tool-free, rapid blade replacement.
Vacuum Suction & Upper Press: Effectively secures warped boards and ensures uniform printing across various PCB thicknesses.
SPI Closed-Loop System: Allows the printer to automatically adjust and correct the platform based on feedback from the Solder Paste Inspection (SPI) machine.
Windows 10 Operating System: Modernized interface and security.
Comprehensive Log Management: Exportable data (Excel/Access) containing all equipment parameters.
Remote Data Export: Supports remote monitoring and status tracking.
Advanced Alarm Logic: Custom thresholds for all parameters; the machine can be set to auto-stop or flag "out-of-spec" events in the log files.
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