GDK MX Plus Solder Paste Printer

Technical Specifications: GDK MX Automatic SMT Stencil Printer

PCB Parameters

Printing Parameters

• Printing Head: Floating intelligent head (Driven by two independent direct-connect motors)

• Template Frame Size: 470mm x 370mm to 737mm x 737mm

• Maximum Printing Area (X x Y): 510mm x 510mm

• Squeegee Type: Steel or Rubber (45°/50°/60° angles to match process)

• Squeegee Length: 300mm + 520mm (Optional: 200mm – 550mm)

• Squeegee Height/Thickness: 65 ± 1mm / 0.25mm (Diamond-like carbon coating)

• Printing Mode: Single or double scraper printing

• Demolding Length: 0.02mm – 12mm

• Printing Speed / Pressure: 0 ~ 200mm/s / 0.5kg – 10kg

• Printing Stroke: ±275mm (From center)

Cleaning & Image Parameters

• Cleaning Modes: Programmable washer fluid injection; Dry, Wet, and Vacuum modes.

• Wiping Board Length: 380mm + 500mm (Optional: 300mm, 450mm).

• Field of View (FOV): 8mm x 6mm.

• Platform Adjustment: X: ±5.0mm, Y: ±7.0mm, θ: ±2.0°.

• Camera System: Independent upward/downward vision system with geometric matching.

• Fiducials: Standard types (Circle, triangle, square, diamond, cross) per SMEMA standards.

Performance & Equipment

• Repeat Precision (Calibration): ±10.0μm @ 6σ, Cpk ≥ 2.0

• Repeat Precision (Printing): ±15.0μm @ 6σ, Cpk ≥ 2.0

• Cycle Time: < 7.5s (Excluding printing and cleaning)

• Product Changeover: < 5 minutes

• Power / Air Requirements: AC220V ±10% (50/60Hz, 15A) / 4~6Kg/cm²

• Weight & Dimensions: ~1000kg / 1220(L) x 1480(W) x 1530(H) mm

Standard Configuration

1. Accurate Optical Positioning System: Features four adjustable light sources for uniform intensity. Ensures perfect image acquisition and identification of uneven mark points on tin, copper, gold, or FPC boards of varying colors.

2. Intelligent Squeegee System: Programmable settings driven by two independent direct motors with a built-in precise pressure control system.

3. High-Efficiency Stencil Cleaning: A new wiping system ensures full contact with the stencil. Includes dry, wet, and vacuum modes (available in free combination) and a soft, wear-resistant rubber wiping plate.

4. HTGD Adaptive PCB Thickness System: Automatically calibrates platform height based on software settings—intelligent, fast, and simple.

5. Simple PCB Positioning: Utilizes programmable elastic side clamps and magnetic supporting devices.

Available Options & Enhancements

• Automatic Solder Paste Filling: Maintains consistent paste levels on the stencil to ensure stable, long-term printing quality and improved productivity.

• Stencil Plugging Detection: Uses CCD and upper light compensation to check mesh in real-time, automatically triggering a clean if a blockage is detected.

• Squeegee Closed-Loop Feedback: Digital sensors monitor and display real-time pressure, adjusting the depth automatically to ensure constant pressure for high-density components.

• MES System Integration: Seamlessly docks with factory MES via 1D/2D barcode scanning for full traceability, material management, and quality control.

• SPI Online Interface: Forms a closed-loop system with the Solder Paste Inspection (SPI) machine. The printer automatically adjusts X/Y offsets based on SPI feedback to eliminate defects.

• Automatic Dispensing: Allows for accurate tin dispensing, line drawing, or filling operations post-printing based on process requirements.

Additional Options Table