| Feature | Specification |
| Maximum Board Size (X x Y) | 450mm x 350mm |
| Minimum Board Size (X x Y) | 50mm x 50mm |
| PCB Thickness | 0.4mm – 6mm |
| Warpage | ≤ 1% (Diagonal) |
| Maximum Board Weight | 3kg |
| Board Margin Gap | Configurable to 3mm |
| Maximum Bottom Gap | 20mm |
| Transfer Speed | 1500mm/s (Max) |
| Transfer Height | 900 ± 40mm |
| Transfer Direction | L-R, R-L, L-L, R-R |
| Transfer Mode | One-stage orbit |
| PCB Damping Method | Programmable flexible side pressure + Adaptive thickness + Edge lock base clamp |
| Support Methods | Magnetic thimbles, Equal high blocks (Optional: Vacuum Chamber or Special Fixtures) |
Printing Head: Floating intelligent head (Two independent direct-connected motors)
Template Frame Size: 470mm x 370mm to 737mm x 737mm
Maximum Printing Area: 450mm x 350mm
Squeegee Type: Steel or Glue scraper (Angles: 45°/50°/60°)
Squeegee Dimensions: 300mm length (Optional: 200mm–500mm); 0.25mm thickness (DLC coating)
Printing Mode: Single or Double scraper printing
Demoulding Length: 0.02mm – 12mm
Printing Speed: 0 – 200mm/s
Printing Pressure: 0.5kg – 10kg
Printing Stroke: ±200mm (From center)
Cleaning System: Drip cleaning; Dry, Wet, and Vacuum modes (Standard length: 380mm)
Field of View (FOV): 8mm x 6mm
Benchmark Points: Standard shapes (SMEMA), solder pads, or openings
Calibration Precision: $\pm 10.0\mu m @ 6\sigma, Cpk \geq 2.0$
Printing Precision: $\pm 20.0\mu m @ 6\sigma, Cpk \geq 2.0$
Cycle Time: < 7s (Excluding printing and cleaning)
Product Changeover: < 5 mins
Precision Optical Positioning: Adjustable four-way light source for uniform imaging. Ensures superior identification of gold-plated, tin-sprayed, or FPC boards even with uneven mark points.
High-Efficiency Stencil Cleaning: Advanced wiping system ensures full stencil contact. Supports dry, wet, and vacuum combinations with soft, wear-resistant rubber plates.
Intelligent Squeegee System: Programmable settings driven by two independent direct motors with integrated precise zero-pressure detection.
Adaptive PCB Positioning: Automatic platform calibration based on PCB thickness for fast, reliable setup.
Servo-Driven Printing Axis: Squeegee Y-axis utilizes a servo screw drive for higher accuracy, stability, and extended service life.
2D Inspection & SPC Analysis: Quickly detects offsets, insufficient solder, or bridging. Integrated SPC software analyzes the CPK index to guarantee consistent printing quality.
Automatic Solder Paste Filling: Real-time monitoring of paste roll diameter with automatic replenishment to ensure continuous, stable production.
Stencil Plugging Detection: Uses CCD imaging to check stencil mesh in real-time, triggering automatic cleaning if a blockage is detected.
Automatic Dispensing: Enables precision glue/tin dispensing and line drawing immediately after the printing process.
Closed-Loop Squeegee Pressure: Digital sensors monitor and adjust squeegee depth in real-time, ensuring constant pressure for fine-pitch components.
Temperature & Humidity Control: Automatically regulates the internal environment to maintain the physical integrity of printing materials.
MES System Integration: Seamlessly syncs with factory MES via 1D/2D code scanning for full traceability, material management, and quality control.
SPI Closed-Loop Interface: Connects with Solder Paste Inspection (SPI) systems to automatically adjust XY offsets (within 3 pulses) based on defect feedback.
| Item No. | Function |
| 1 | Paste Roll Height Monitor (aPRHM) |
| 2 | Internal Temperature/Humidity Work Area Detection |
| 3 | Windows 10 Operating System |
| 4 | Upper Press Function (for warped boards) |
| 5 | Extended PCB Size (525mm x 350mm) |
| 6 | Grid-Lock PCB Support Method |
| 7 | Support Pin/Block Detection Sensors |
| 8 | Advanced Data Logging (Export to Excel/Access, Remote Export, and UPS Support) |
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