LOCTITE® 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. LOCTITE 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
KEY FEATURES:
| Colour | Red |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Gel |
| Shear strength, Steel (grit blasted) | 1450.0 psi |
| Storage temperature | 2.0 - 8.0 °C |
| Viscosity, cone & plate Haake PK100, M10/PK1, 2° | 0.16 - 20.0 Pa"s |
Malaysia
