CS4334KS

CS4334KS

分类: Elec-component 当前有货 (数量:9999999)
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Parameter Description Value
Device High Performance Stereo DAC with Headphone Amplifier CS4334KS
Package 28-pin TSSOP -
Operating Voltage Supply Voltage for Digital Core 1.8V ± 10%
Supply Voltage Supply Voltage for Analog Section 2.5V to 5.25V
Power Consumption Typical Power Consumption (with HP amp) 170mW @ 3.3V
Sampling Rate Supported Sampling Rates 8kHz to 96kHz
SNR Signal-to-Noise Ratio (A-weighted) 105dB
THD+N Total Harmonic Distortion + Noise (A-weighted) -95dB
Output Headphone Output Impedance 32Ω
Line Output Line Output Impedance 1kΩ
Channels Number of Audio Channels 2 (Stereo)
Interface Digital Audio Interface I2S, Left-Justified, DSP
Control Interface Control Interface I2C, SPI
Temperature Range Operating Temperature Range -40°C to 85°C
ESD Protection Electrostatic Discharge Protection HBM: 2kV, MM: 1kV

Instructions for Use

  1. Power Supply Connections:

    • Connect VDDA (Analog Supply) to a stable 2.5V to 5.25V supply.
    • Connect VDDD (Digital Supply) to a stable 1.8V supply.
    • Ensure proper decoupling capacitors are placed close to the power pins.
  2. Digital Audio Input:

    • Connect the digital audio input signals (BCLK, LRCLK, DIN) to the corresponding pins on the CS4334KS.
    • Configure the interface mode (I2S, Left-Justified, DSP) using the control interface.
  3. Control Interface:

    • Use the I2C or SPI interface to configure the device settings such as volume, mute, and other operational parameters.
    • Refer to the datasheet for specific register addresses and bit definitions.
  4. Headphone and Line Outputs:

    • Connect the headphone output (HPLOUT, HPLN, HPRN, HPROUT) to the headphones.
    • Connect the line output (LOUT, LIN) to external amplifiers or line-level inputs.
  5. Grounding:

    • Ensure a common ground connection between the CS4334KS and all connected components to avoid ground loops and noise issues.
  6. Thermal Management:

    • Place the device in an area with adequate airflow and ensure the PCB layout includes thermal vias to dissipate heat effectively.
  7. Testing:

    • After assembly, test the device by playing a known audio signal and verifying the output quality using a spectrum analyzer or similar tool.
  8. Storage and Handling:

    • Store the device in a dry, ESD-protected environment.
    • Handle the device with ESD-protected equipment to prevent damage from static electricity.

For detailed information, refer to the CS4334KS datasheet and application notes provided by the manufacturer.

(For reference only)

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