DISCO DFD 641 is a high-precision scribing and dicing equipment designed for use in the semiconductor industry. The system is ideal for cutting die and molding applications in the production of integrated circuits, thin-film transistors, light-emitting diodes, and other micromachined devices. DISCO DFD641 utilizes a diamond-cut saw blade to provide the highest level of accuracy and the best surface finish. This makes it ideal for high-end applications such as IC fabrication and thin-film technology.
Malaysia
