X-7900 Inspection System
High-precision semiconductor and integrated circuit testing solution designed for BGA, IGBT, and PCBA assembly verification.
Product Overview
The X-7900 is engineered for detecting defects in integrated circuits, semiconductor devices, and various battery types such as power batteries and cylindrical cells. It serves critical industries like LED, photovoltaics, and heatsink manufacturing with non-destructive testing capabilities.
Main Features
Joystick Control
Intuitive FPD zoom and magnification control with real-time speed adjustment via button controls.
360° Rotary Stage
Enables full rotation for sample inspection, reducing manual adjustments and ensuring precise positioning.
High Magnification
Optical and system magnification up to 2000X for ultra-fine defect analysis in high-end configurations.
Radiation Safety
Built-in safety protocols ensuring leakage levels remain below 1 μSV/H during operation.
System Capabilities
Technical Specifications
| Category | Technical Parameter | Specification Detail (X-7900) |
|---|---|---|
| X-Ray Tube | Tube Type | Enclosed Type |
| Spatial Resolution | 3μm | |
| Tube Voltage / Current | 130KV / 300μA | |
| Imaging Unit (FPD) | Imaging Precision | 85μm |
| A/D Density Value | 16bit (65536) | |
| Resolution | 1536 x 1536px | |
| Frame Frequency | 20 FPS | |
| System & Structure | Operating System | WINDOWS 11 |
| Detection range | 510 x 510mm | |
| Machine Weight | 1050kg |
Versatile Applications
Semiconductor
High-precision testing for BGA, IGBT, Flip Chip, and PCBA component soldering.
Energy & Battery
Internal defect detection for Lithium batteries, power batteries, and nickel strips.
Hardware & LED
Inspection of MINI LED packages, sensors, and complex hardware connectors.
