High-precision confocal and thermoreflectance microscope for non-contact 3D surface measurement, profile and roughness analysis, and sub-micron thermal imaging of microelectronic and advanced material structures. The system combines a laser scanning confocal module with a thermoreflectance imaging module, enabling accurate surface profiling, roughness evaluation, dimensional inspection, and thermal distribution analysis on micro and submicron structures. Its non-contact, non-destructive operating approach allows users to place a sample directly on the XY stage and begin measurement with minimal preparation. The optics are optimized for high measurement accuracy across the field of view, while intuitive software supports both novice and experienced users. CTRM 750 is suitable for semiconductor devices, MEMS, FPD and display structures, thin film solar cells, coatings, tooling surfaces, glass structures, and thermal analysis of heat-generating micro devices. The open modular configuration also supports flexible customization for different research and inspection environments. Measures delicate surfaces without touching the sample, helping prevent surface damage and eliminating the need for complex sample preparation. High-NA objective lenses and dedicated optics optimized for the laser wavelength improve accuracy, reduce aberration, and capture the correct sample shape across the field of view. Measures reflectivity changes caused by temperature variation to provide high-resolution thermal imaging of microscopic areas beyond the limits of conventional infrared methods. Open modular design supports integration with other systems and can be customized for specific measurement and research requirements. Supports height, width, angle, area, volume, profile, and roughness measurements for cutting surfaces, films, coatings, and patterned microstructures. Captures time-dependent thermal response through precise synchronization of pulsed light sources and imaging devices for advanced dynamic thermal analysis. CTRM 750 confocal module provides laser scanning confocal imaging using a source, sample, and detector arrangement. By rejecting out-of-focus signals, only in-focus light is collected by the detector. This gives the system optical sectioning capability and improves image quality by reducing noise outside the focal point. To measure height, the microscope acquires multiple confocal images while automatically shifting the focus position along the Z axis. Because light intensity becomes maximum when the sample surface is at the focal plane, axial coordinates can be determined directly. The module uses a red laser, photo-multiplier tube (PMT), and piezoelectric axial scanner for reliable confocal optical sectioning. With its powerful optical performance, CTRM 750 enlarges the application area of optical microscope imaging. Features under transparent or semi-transparent layers can be inspected clearly, and surfaces of light-emitting or highly heated materials can be monitored more effectively than with conventional optical microscopes. The system supports intuitive profile analysis and roughness measurement for cutting surfaces, film surfaces, coatings, and precision-structured samples. This makes it highly suitable for both routine inspection and research-grade metrology tasks. IC patterns, bump height, wire loop height, CMOS features, defect inspection, CMP process checks, connector pins, and microelectronic heat distribution analysis. Touch panel screen inspection, ITO pattern measurement, LCD column spacer height evaluation, and related fine-structure dimensional analysis. 3D profile measurement, surface roughness, micro heater analysis, micro transistor imaging, MEMS structures, and transient thermal response characterization. Thin film solar cell inspection, solar cell texture evaluation, grism structures, laser pattern analysis, and surface feature measurement on transparent materials. Coating particle analysis, coating surface defect inspection, tooling surface evaluation, crack analysis, and film roughness measurement. Heat-generating micro devices, poly-Si structures, carbon sheets, 4 μm pattern analysis, and microscopic thermal imaging where conventional IR methods reach their limits. The thermoreflectance imaging module measures the distribution of optical reflectance on the sample surface as temperature changes. By calculating reflectivity changes, the system derives surface temperature information and generates thermal images with excellent spatial resolution. This technology enables high-resolution micro-thermography in microscopic areas that cannot be achieved by conventional exotherm or infrared imaging techniques. It provides a powerful analytical tool for thermal analysis of microelectronic circuits and heat-generating structures. The system measures changes in reflectivity caused by brightness variation at different temperatures and converts them into temperature indication, enabling accurate interpretation of thermal distribution. Thermoreflectance coefficient response depends on wavelength. CTRM 750 supports 12 pulse LED wavelengths in the default configuration, allowing flexible optimization for different materials and measurement targets. To interpret thermo-reflectance images as actual temperature information, reference images at specific temperatures are required. For this purpose, CTRM 750 includes a thermoelectric heating vacuum plate. The plate uses a Peltier device and cooling fin structure for fast and accurate heating and cooling. A vacuum suction hole helps fix the sample in place, and an embedded temperature sensor monitors the plate temperature under software control. The reflectivity change at specific time instances can be measured accurately through precise and timely control of the pulsed light source and imaging devices. This allows users to analyze how temperature changes with time, making transient thermal response one of the unique strengths of the thermoreflectance microscope.
Advanced Optical & Thermal Analysis System
CTRM 750 Confocal Thermoreflectance Microscope
Product Overview
CTRM 750 is an integrated confocal and thermoreflectance microscope platform developed for users who need reliable non-contact metrology and high-spatial-resolution thermal analysis in one advanced system.
Key Specifications
Main Features
Non-Contact Measurement
Reliable Confocal Data
Thermoreflectance Imaging
Flexible Configuration
3D Profile & Roughness Analysis
Transient Thermal Imaging
Confocal Measurement Principle
Laser Scanning Confocal Imaging
Height Measurement Method
Optical Performance & Analysis Capability
Expanded Optical Inspection Range
Profile and Roughness Analysis
Application Fields
Semiconductor Inspection
Display & FPD Structures
MEMS & Micro Devices
Solar Cell & Glass Surfaces
Coatings & Materials Research
Thermal Analysis Applications
Thermoreflectance Imaging Principle
How It Works
Why It Matters
Thermal Imaging Advantages
Brightness-to-Temperature Conversion
Multi-Wavelength Illumination
Thermoelectric Heating Vacuum Plate
Reference Temperature Imaging
Fast, Stable Temperature Control
Transient Thermal Imaging
Time-Resolved Thermal Response
Detailed Specifications
Category
Parameter
Specification
Objective Lens
Magnification
5x, 10x, 20x, 50x, 100x
Working Distance
34 mm, 33.5 mm, 20 mm, 13 mm, 6 mm
Numerical Aperture
0.14, 0.28, 0.42, 0.55, 0.7
Field of View (Confocal Imaging Mode)
Horizontal
2800 / 1400 / 700 / 280 / 140 μm
Vertical
2100 / 1050 / 525 / 210 / 105 μm
Field of View (Thermal Imaging Mode)
Horizontal
1330 / 655 / 332 / 133 / 65 μm
Vertical
1330 / 655 / 332 / 133 / 65 μm
Confocal Imaging Mode
Optical Zoom
x1 to x6
Total Magnification
178x to 26700x
Observation / Measurement Optics
Pinhole confocal optical system
Frame Rate
10 Hz to 160 Hz depending on pixel count
Height Measurement
Measuring Range
10 mm
Repeatability
σ 0.030 μm (Note 1)
Width Measurement
Pixel Resolution
1024×768, 1024×384, 1024×192, 1024×96
Repeatability
3σ 0.040 μm (Note 2)
Confocal Light Source
Wavelength
638 nm
Output
~ 2 mW
Laser Class
Class 3b
Light-Receiving Element
PMT
Thermal Imaging Mode
Imaging Sensor
Scientific CMOS
Spectral Range
370 ~ 800 nm
Active Imaging Pixels
2048 × 2048 pixels
Active Thermal Imaging Pixels
1024 × 1024 pixels
Spatial / Thermal Resolution
0.5 μm lateral / 1°C
Thermoreflectance Imaging
Imaging Modes
Steady state (Asynchronous FFT, 4-Bucket), Transient
Transient Time Resolution
50 nsec ~ 1 msec (FWHM)
Illumination for Thermoreflectance Microscope
Light Source Type
Pulse LEDs
Number of Wavelengths
12
Output Power
120 ~ 3000 mW (wavelength dependent)
Default Wavelength Configuration
430, 455, 470, 505, 530, 565, 590, 617, 625, 660, 700, 730 nm (customizable)
Thermoelectric Heating Plate
Heating Range
RT to 110°C
Heating / Cooling Rate
Approx. 2 min from RT to 90°C, approx. 5 min from 90°C to RT (without sample)
Data Processing Unit
Detected PC
PC-based processing system
Power Supply
Input Voltage
100 to 240 VAC, 50/60 Hz
Current Consumption
500 VA max.
Weight
System Weight
Approx. 60 kg total (Measuring head approx. 19 kg / Controller approx. 8 kg)
Malaysia
