The XP Series is a high-performance, ultra-compact thermal profiling solution specifically engineered for reflow ovens with narrow clearance entrances. Designed for portability and extreme precision, this series provides real-time thermal analysis, intelligent early warnings, and comprehensive data export functions to maximize production yield and maintain process stability.
Ultra-Slim Adaptation: The low-profile design effortlessly traverses narrow furnace openings and is compatible with diverse reflow oven configurations
High-Precision Metrology: Features a measurement accuracy of $±0.5°C$, significantly reducing process deviation and enhancing product reliability
Intelligent Thermal Analysis: Automatically generates process window reports to identify anomalies rapidly and mitigate quality risks
Streamlined Data Management: Supports one-click data export to Excel, PDF, or TXT formats for seamless traceability and regulatory compliance
Real-Time Monitoring: Generates live temperature curves for immediate visual feedback
Process Window Index (PIS): Evaluates overall process stability and calculates pass rates via an integrated PIS index
Smart Storage: Internal memory capable of storing up to 30 individual data sets for continuous testing
Abnormal Alerts: Integrated over-temperature alarms and communication status prompts for enhanced safety
| Specification | XP107S | XP109S | XP113S |
| Number of Channels |
7 Channels
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9 Channels
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13 Channels
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| Profiler Size (mm) |
L146 × W61 × H19
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L146 × W78 × H19
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L146 × W110 × H19
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| Insulation Box Size |
L345 × W114 × H35
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L345 × W130 × H35
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L345 × W162 × H35
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| Accuracy / Resolution |
$±0.5°C$ / $0.1°C$
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| Measurement Range |
$0$ to $750°C$
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| Probe Type |
K-Type Thermocouple
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| Acquisition Rate |
0.1s to 30s (Adjustable)
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| Memory Capacity |
86,400 Data Points
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| Start / Stop Method |
Button, Delay, or Temperature-triggered
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| Insulation Material |
Specialized Stainless Steel Sleeve
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| Data Transfer |
High-speed USB Connection
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SMT Reflow Soldering: Continuous oven temperature monitoring to ensure soldering quality
New Product Introduction (NPI): Parameter verification and thermal profile optimization for new assemblies
Quality Auditing: Randomized thermal sampling to prevent the production of defective hardware
Process Optimization: Deep analysis of PIS data to refine and improve production efficiency
Local Technical Support: We offer local calibration services and on-site training for the XP Series software.
Rapid Response: Local inventory of K-type probes and stainless steel insulation boxes.
System Integration: Assistance with setting up automated reporting on your Windows-based PC workstations.
Malaysia
