The GDK 5M Automatic Solder Paste Printer is designed for large-scale PCB production, capable of handling high-precision components such as 0402, 0201, and 01005. It offers superior molding and soldering volume consistency. For maximum production flexibility, the units can be configured back-to-back or used as a standalone machine.
Maximum Printing Range: 530mm x 510mm
Certifications: CE Certified, Award Certificate, Software Work Certificate, and Certificate of Authorization.
| Feature | Specification |
| Max. Board Size (X x Y) | 530mm x 510mm |
| Min. Board Size (X x Y) | 50mm x 50mm |
| PCB Thickness Range | 0.4mm – 6mm |
| PCB Warpage | ≤ 1% Diagonal |
| Max. Board Weight | 5kg |
| PCB Edge Clearance | 3mm (Configurable) |
| PCB Bottom Clearance | 20mm |
| Conveyor Speed | 1500mm/s (Max) |
| Conveyor Height | 900 ± 40mm |
| Transfer Mode | One-stage Conveyor |
| PCB Clamping Method | Auto-thickness adjustment + Programmable elastic side clamps |
| Optional Clamping | Edge locking, bottom integral cavity vacuum, or multi-point local vacuum |
| Support Method | Magnetic thimble + Equal height blocks (Optional: Vacuum suction cavity) |
| Feature | Specification |
| Printing Head | Floating intelligent head (Two independent direct-connect motors) |
| Stencil Frame Size | 470mm x 370mm to 737mm x 737mm |
| Squeegee Material | Steel or Rubber (Angles: 45°/50°/60°) |
| Squeegee Length | 300mm + 520mm (Optional: 200mm – 550mm) |
| Print Speed / Pressure | 0 – 200 mm/s / 0.5kg – 10kg |
| Cleaning System | Programmable wet/dry/vacuum modes with fluid injection |
| Feature | Specification |
| Alignment Repeatability | ±10.0μm @ 6σ, Cpk ≥ 2.0 |
| Process Repeatability | ±15.0μm @ 6σ, Cpk ≥ 2.0 |
| Core Cycle Time | 7.5s (Excluding printing and cleaning) |
| Changeover Time | < 5 minutes |
| Operating System | Windows XP (Options: Win 7 / Win 10) |
| Machine Weight | Approx. 980kg |
High-Precision Optical Positioning: Features four adjustable light sources for uniform illumination and perfect image acquisition. It easily identifies uneven mark points on copper, gold, or tin plating, and FPC boards.
Efficient Stencil Cleaning: A new wiping system ensures full contact and high vacuum suction to eliminate solder paste residue from the mesh, utilizing an anti-static roller.
Servo-Driven Printing Axis: The Y-axis uses a servo motor with a screw drive for higher accuracy, smoother operation, and extended service life.
Intelligent Squeegee System: Programmable settings with two independent motors and a built-in precise zero-pressure detection system.
2D Inspection & SPC Analysis: Quickly detects offsets, insufficient tin, or bridging. Integrated SPC software analyzes CPK indices to guarantee consistent print quality.
Automatic Solder Paste Filling: Real-time monitoring of paste roll diameter with automated dispensing to ensure stable, continuous production.
Stencil Clogging Detection: Uses CCD technology and overhead light compensation to check mesh status in real-time.
Closed-Loop Squeegee Pressure Control: Digital sensors adjust pressure depth intelligently to maintain constant values, perfect for high-density components.
MES System Integration: Seamlessly scans 1D/2D codes to share data with your MES for full traceability, material management, and quality control.
SPI Online Interface: Forms a closed-loop system with the Solder Paste Inspection (SPI) machine to automatically adjust XY offsets based on feedback.
Temperature & Humidity Control: Regulates the internal environment to maintain the physical characteristics of the solder materials.
| Item | Function / Specification |
| 1 | Paste Roll Height Monitor (aPRHM) |
| 2 | Internal work area temperature/humidity detection |
| 3 | Windows 10 OS Upgrade |
| 4 | Grid-Lock PCB board support method |
| 5 | Solder paste delivery from 6 oz Semco cartridges |
| 6 | Touch screen monitor control |
| 7 | SSD-equipped industrial PC |
| 8 | Comprehensive Log-File system (Exportable to Excel/Access for remote monitoring) |
| 9 | Uninterruptible Power Supply (UPS) |
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