SHINKAWA UTC-2000 Super is an ultra-precision, fully automated, and high-throughput wire bonder designed for a wide range of thermocompression, ultrasonic and thermosonic bonding processes. With its single-wheel design, it can perform up to 100 bonds per second with unparalleled accuracy and minimal handling time. SHINKAWA UTC2000 SUPER is capable of handling very small, delicate wire sizes, from 0.1mm to 0.7mm, and provides precise control over the bond parameters, allowing it to produce highly reliable results. Its advanced features include automated wire cleaning, an automated alignment system for aligning and balancing wire bonds, and a high-powered automatic bonding tool vibrator for accurate bonding.
