TL2845BDG4

TL2845BDG4

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Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 4.5 - 36 V -
Quiescent Current IQ - 100 200 μA VCC = 5V, No Load
Output Voltage (Low) VOL 0 0.4 0.8 V IL = 10mA
Output Voltage (High) VOH 2.4 3.5 5.5 V IH = -10mA
Output Current (Sink) IOL -100 - -50 mA VOL ≤ 0.4V
Output Current (Source) IOH 50 - 100 μA VOH ≥ 2.4V
Input Voltage (High) VIH 2.0 - VCC V -
Input Voltage (Low) VIL 0 - 0.8 V -
Input Current II -1 - 1 μA -
Propagation Delay Time tpd 20 - 100 ns VCC = 5V, Typical Load
Operating Temperature Range TA -40 - 125 °C -
Storage Temperature Range TSTG -65 - 150 °C -

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 4.5V to 36V to avoid damage to the device.
  2. Quiescent Current (IQ):

    • The quiescent current should be monitored to ensure it does not exceed 200μA under no-load conditions.
  3. Output Voltage:

    • When the output is low, the voltage should not exceed 0.8V with a load current of 10mA.
    • When the output is high, the voltage should be at least 2.4V with a load current of -10mA.
  4. Output Current:

    • The device can sink up to -100mA and source up to 100μA without exceeding the specified output voltage levels.
  5. Input Voltage:

    • The input voltage should be between 0V and VCC to ensure proper operation. For logic high, the input voltage should be at least 2.0V.
  6. Input Current:

    • The input current should be kept within ±1μA to avoid excessive power consumption or potential damage.
  7. Propagation Delay Time (tpd):

    • The propagation delay time should be considered when designing circuits to ensure timing requirements are met.
  8. Temperature Ranges:

    • The operating temperature range is from -40°C to 125°C, and the storage temperature range is from -65°C to 150°C. Ensure the device is used within these limits to avoid failure.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components. Use appropriate ESD protection measures during handling and installation.
  10. Mounting:

    • Follow recommended soldering profiles and mounting guidelines to ensure reliable performance and longevity of the device.
(For reference only)

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