FOD3120SD: 马来西亚的首选 Utsource Holding Company Limited

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BUY FOD3120SD https://www.utsource.net/itm/p/11252761.html

Parameter	Symbol	Min	Typ	Max	Unit
Input Voltage	V_IN	4.5	-	20	V
Output Voltage	V_OUT	-	5	-	V
Output Current	I_OUT	-	1.5	-	A
Isolation Voltage	V_ISO	-	2500	-	V_RMS
Propagation Delay	t_pd	100	150	200	ns
Propagation Delay Skew	t_skew	-	20	-	ns
Common-Mode Transient Immunity	CMTI	-	25	-	kV/μs
Operating Temperature	T_OP	-40	-	85	°C
Storage Temperature	T_STG	-65	-	150	°C
Quiescent Current	I_Q	-	0.5	-	mA

Instructions for Using the FOD3120SD

Input Voltage (V_IN):
- Ensure the input voltage is within the range of 4.5V to 20V.
- Connect the input power supply to the appropriate pins on the device.
Output Voltage (V_OUT):
- The output voltage is regulated to 5V. No external components are required for this regulation.
Output Current (I_OUT):
- The device can provide up to 1.5A of output current. Ensure that the load does not exceed this limit to avoid damage.
Isolation Voltage (V_ISO):
- The device provides 2500V_RMS isolation between the input and output sides. This ensures electrical safety and noise immunity.
Propagation Delay (t_pd):
- The typical propagation delay is 150ns, with a minimum of 100ns and a maximum of 200ns. This delay should be considered when designing timing-sensitive circuits.
Propagation Delay Skew (t_skew):
- The propagation delay skew is typically 20ns. This parameter is important for applications requiring precise timing synchronization.
Common-Mode Transient Immunity (CMTI):
- The device has a common-mode transient immunity of 25kV/μs, which helps in maintaining signal integrity in noisy environments.
Operating Temperature (T_OP):
- The operating temperature range is from -40°C to 85°C. Ensure that the device is used within this range to prevent thermal damage.
Storage Temperature (T_STG):
- The storage temperature range is from -65°C to 150°C. Store the device in a dry and cool place to maintain its performance.
Quiescent Current (I_Q):
- The quiescent current is typically 0.5mA. This low current consumption makes the device suitable for battery-powered applications.

Additional Notes:

Always refer to the datasheet for detailed specifications and application notes.
Use appropriate heat sinks or cooling methods if the device is expected to operate at high temperatures or under heavy loads.
Ensure proper PCB layout to minimize noise and interference, especially for high-frequency applications.

(For reference only)