HD74LS367AP: 马来西亚的首选 Utsource Holding Company Limited

详情

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	V_CC	Operating	4.75	-	5.25	V
Input Low Voltage	V_IL	-	0.8	-	-	V
Input High Voltage	V_IH	-	-	-	2.0	V
Output Low Voltage	V_OL	I_OL = 16 mA	0.25	-	-	V
Output High Voltage	V_OH	I_OH = -0.4 mA	-	-	2.4	V
Propagation Delay Time (Low to High)	t_PLH	V_CC = 5V, I_L = 1.6 mA, I_H = -0.4 mA	-	15	-	ns
Propagation Delay Time (High to Low)	t_PHL	V_CC = 5V, I_L = 1.6 mA, I_H = -0.4 mA	-	15	-	ns
Power Dissipation	P_D	Maximum	-	-	500	mW
Operating Temperature Range	T_A	-	0	-	70	°C
Storage Temperature Range	T_STG	-	-40	-	150	°C

Power Supply:
- Ensure the supply voltage (V_CC) is within the specified range of 4.75V to 5.25V.
- Connect the ground (GND) pin to a stable 0V reference.
Input Signals:
- Input signals should be within the valid logic levels: V_IL ≤ 0.8V for LOW and V_IH ≥ 2.0V for HIGH.
Output Signals:
- The output low voltage (V_OL) should not exceed 0.25V when sourcing 16 mA.
- The output high voltage (V_OH) should be at least 2.4V when sinking -0.4 mA.
Propagation Delay:
- The propagation delay times (t_PLH and t_PHL) are typically 15 ns under standard conditions.
Power Dissipation:
- Do not exceed the maximum power dissipation of 500 mW to avoid overheating and potential damage.
Temperature:
- Operate the device within the temperature range of 0°C to 70°C.
- Store the device within the temperature range of -40°C to 150°C.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Use proper ESD protection equipment when handling the device.
Mounting:
- Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
- Follow the recommended PCB layout guidelines for optimal performance and reliability.

(For reference only)