2SK190: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Value	Unit
Maximum Drain Voltage	VDS(max)	300	V
Maximum Gate-Source Voltage	VGS(max)	±20	V
Maximum Drain Current	ID(max)	2.5	A
Maximum Power Dissipation	PD(max)	80	W
Gate Threshold Voltage	VGS(th)	2 to 4	V
Transconductance	gm	0.7 to 2.5	S
Input Capacitance	Ciss	1500	pF
Output Capacitance	Coss	300	pF
Reverse Transfer Capacitance	Crss	100	pF
Junction Temperature	TJ	-55 to +150	°C
Storage Temperature	Tstg	-55 to +150	°C

Handling Precautions:
- Avoid exposing the device to excessive static electricity.
- Use proper anti-static wrist straps and mats when handling the device.
Mounting:
- Ensure good thermal contact with a heatsink to manage power dissipation.
- Use thermal compound between the device and the heatsink for better heat transfer.
Biasing:
- Apply the gate voltage (VGS) within the specified range to avoid damage.
- Ensure the gate-source voltage does not exceed ±20V.
Operating Conditions:
- Operate the device within the maximum drain voltage (300V) and drain current (2.5A) limits.
- Keep the junction temperature within the specified range (-55°C to +150°C).
Storage:
- Store the device in a dry, cool place away from direct sunlight.
- Ensure the storage temperature is within the specified range (-55°C to +150°C).
Testing:
- Use appropriate test equipment to measure parameters such as transconductance and capacitances.
- Follow standard testing procedures to avoid damaging the device.
Soldering:
- Use a controlled soldering process to avoid overheating the device.
- Allow the device to cool down before applying power.
Circuit Design:
- Design the circuit to include necessary protection components such as fuses and transient voltage suppressors.
- Ensure the circuit layout minimizes parasitic inductances and capacitances.

(For reference only)