HD3SS6126RUAR

HD3SS6126RUAR

Category: Elec-component Available (Qty:9999999)
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Description

BUY HD3SS6126RUAR https://www.utsource.net/itm/p/12612303.html

Parameter Description Value Unit
Supply Voltage (VDD) Operating supply voltage range 2.7 to 5.5 V
Supply Current (IDD) Quiescent supply current (Typical) 1.0 μA
Channel Configuration Number of channels 2 -
Channel Resistance (RON) On-state resistance per channel (Typical) 0.8 Ω
Channel Capacitance (Cin) Input capacitance per channel (Typical) 4.5 pF
Switching Time (tON, tOFF) Turn-on/turn-off time (Typical) 15 ns
Maximum Continuous Current (IOUT) Continuous output current per channel ±200 mA
Maximum Pulse Current (IOUT) Peak pulse output current per channel ±400 mA
Operating Temperature Range (TA) Ambient operating temperature range -40 to 85 °C
Storage Temperature Range (TSTG) Storage temperature range -65 to 150 °C
ESD Rating (HBM) Human body model electrostatic discharge rating 2000 V
ESD Rating (MM) Machine model electrostatic discharge rating 200 V
Package Type Type of package SOT-23-6 -

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 2.7V to 5.5V.
    • Connect the supply voltage to the VDD pin and ground to the GND pin.
  2. Channel Configuration:

    • The HD3SS6126RUAR has two channels. Each channel can be independently controlled.
    • Connect the input signals to the IN1 and IN2 pins, and the corresponding outputs will be available at OUT1 and OUT2.
  3. Current Handling:

    • Do not exceed the maximum continuous current of ±200mA or the peak pulse current of ±400mA per channel.
    • Ensure that the load connected to the output does not draw more current than these limits.
  4. Temperature Considerations:

    • Operate the device within the ambient temperature range of -40°C to 85°C.
    • Store the device within the storage temperature range of -65°C to 150°C.
  5. ESD Protection:

    • Handle the device with care to avoid electrostatic discharge (ESD).
    • Use appropriate ESD protection measures during handling and installation.
  6. Layout and PCB Design:

    • Use short traces for high-frequency signals to minimize parasitic inductance and capacitance.
    • Ensure proper grounding and decoupling capacitors are used to maintain stable operation.
  7. Testing and Verification:

    • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications.
    • Verify the switching times and on-state resistance to ensure optimal performance.
(For reference only)

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