LT3790IFE#PBF

LT3790IFE#PBF

Category: Elec-component Available (Qty:9999999)
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Description

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Parameter Symbol Min Typical Max Unit
Input Voltage Range VIN 4.5 - 60 V
Output Voltage Range VOUT 0.8 - 100 V
Switching Frequency fSW 100 500 1000 kHz
Output Current (Continuous) IOUT - 10 - A
Efficiency (Typical) η - 92 - %
Quiescent Current IQ - 1.2 - mA
Shutdown Current ISD - 1 - μA
Operating Temperature Range Toper -40 - 125 °C
Storage Temperature Range Tstg -65 - 150 °C
Junction Temperature TJ -40 - 150 °C

Instructions for Use

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 60V.
    • Connect the input power supply to the VIN pin.
  2. Output Voltage (VOUT):

    • Set the desired output voltage using the feedback resistor network.
    • The output voltage can be adjusted from 0.8V to 100V.
  3. Switching Frequency (fSW):

    • Set the switching frequency by connecting an external resistor to the RT pin.
    • The typical switching frequency is 500kHz, but it can be adjusted between 100kHz and 1000kHz.
  4. Output Current (IOUT):

    • The continuous output current is up to 10A.
    • Ensure the inductor and other components can handle the required current.
  5. Efficiency:

    • The typical efficiency is 92%.
    • Optimize the design for maximum efficiency by selecting appropriate components and minimizing losses.
  6. Quiescent Current (IQ):

    • The quiescent current is typically 1.2mA.
    • This is the current consumed by the IC when it is active but not delivering power to the load.
  7. Shutdown Current (ISD):

    • The shutdown current is typically 1μA.
    • Use the SHDN pin to control the shutdown mode.
  8. Operating Temperature (Toper):

    • The operating temperature range is from -40°C to 125°C.
    • Ensure the device is used within this range to avoid damage.
  9. Storage Temperature (Tstg):

    • The storage temperature range is from -65°C to 150°C.
    • Store the device in a dry and cool environment.
  10. Junction Temperature (TJ):

    • The junction temperature should not exceed 150°C.
    • Use proper heat sinking and cooling methods to manage the junction temperature.
  11. PCB Layout:

    • Follow recommended PCB layout guidelines to minimize noise and ensure stable operation.
    • Keep high-current paths short and wide to reduce resistance and inductance.
  12. Component Selection:

    • Choose components with ratings that exceed the maximum expected values to ensure reliability.
    • Use high-quality capacitors and inductors suitable for the application.
  13. Protection:

    • Implement overvoltage, overcurrent, and thermal protection circuits as needed.
    • Monitor the output voltage and current to prevent damage to the load or the IC.
(For reference only)

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