Ensure Reliability. Optimize Production. Enhance Product Quality.
At Redmark Industry Sdn. Bhd., we supply advanced, precision-driven testing and inspection systems tailored for the demanding requirements of semiconductor manufacturing. From detecting microscopic defects to simulating harsh environmental conditions, our equipment helps you maintain consistency, compliance, and confidence in every chip you produce.
Detect faults before they affect final products. Our solutions allow for early defect detection, electrical performance verification, and real-time process control—helping you avoid costly rework or product recalls.
Simulate real-world stressors such as thermal cycling, humidity, and vibration to ensure long-term durability of semiconductor components—especially important in automotive, medical, and aerospace applications.
Our inspection and testing systems support high-throughput production lines, reducing downtime, minimizing waste, and improving overall yield.
Every facility is different. We offer modular and customizable systems to meet your exact specifications—supported by our experienced team offering consultation, installation, training, and ongoing maintenance.
| BIL | CATAGORIES | DECRIPTION | LEARN MORE |
| ENVIRONMENTAL TESTING SYSTEMS | |||
| 1. | Ozone Aging Chamber | Accelerated aging tests for rubber/plastic components used in semiconductor tools. |
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| 2. | UV Testing Chamber | Simulate exposure to UV for optical or plastic parts | |
| 3. | Oven Chamber/ Drying Chamber | Pre-bake wafers, dry components, remove moisture before packaging. | |
| 4. | Temperature & Humidity Chambers | Used to assess how semiconductor devices perform under different temperature and humidity levels. | |
| 5. | Thermal Shock Chambers | Evaluate the resilience of components to rapid temperature changes, which is critical for semiconductor reliability. | |
| 6. | Corrosion Test Chambers (Salt Spray,SO2,NOx) | Test leadframe, plating, bond pad corrosion resistance | |
| 7. | Gas Purge Chambers | Inert gas environment (N₂, Ar) to prevent oxidation. | |
| WAFER INSPECTION & METHROLOGY | |||
| 8. | Optical Microscope | ||
| 9. | 3D Printer | ||
| 10. | Particle Counter | ||
| 11. | Wafer Thickness Gauge | ||
| 12. | Profilometer | ||
| FAILURE ANALYSIS TOOLS | |||
| 13. | X-Ray Inspection System | ||
| 14. | Thermal Imager | ||
| REALIBILITY TEST EQUIPMENT | |||
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