Wire-Saw Coolant is a specialized cutting and cooling fluid designed for precision wafer slicing and lapping processes using diamond wire-saw technology. Developed to meet the strict demands of semiconductor, solar, and advanced material manufacturing, this coolant ensures stable cutting performance, efficient heat dissipation, and excellent surface quality. It is suitable for slicing materials such as silicon, sapphire, quartz, and solar cell wafers, where dimensional accuracy and surface integrity are critical.
Effectively reduces friction between the diamond wire and workpiece, extending wire life and lowering tooling costs
Rapid heat dissipation prevents wafer cracking, warping, and thermal damage during high-speed cutting
Excellent flushing performance removes cutting debris efficiently, reducing scratches and surface defects
Stable dispersion characteristics support consistent cutting quality throughout the process
Provides rust prevention to protect both wafers and machine components
Easy filtration and recyclability support cost-effective operation and environmentally responsible processes
Available in oil-based and water-soluble formulations to support different cutting methods and abrasive grain types
These wire-saw coolants are engineered for free adhesive grain and fixed adhesive grain processes, offering flexible usage options depending on cutting requirements. Both concentrated and diluted systems are supported, allowing manufacturers to optimize cooling performance, cutting efficiency, and operating costs.
| Product No. | Type | Application |
|---|---|---|
| LW-10 | Oil-based (non-dilute) | For wire-saw cutting with free adhesive grain |
| GL-10 | Glycol type (DEG) | For slicing semiconductor wafers, solar cell wafers, and similar materials using wire-saw |
| GL-10P | Glycol type (PG) | For slicing semiconductor wafers, solar cell wafers, and similar materials using wire-saw |
| SW-30 | Water-soluble (50× dilution) | For wire-saw cutting with fixed adhesive grain |
| LP-50 | Water-soluble (20–30× dilution) | For lapping with free adhesive grain |
| LP-40 | Water-soluble (20–30× dilution) | For lapping with free adhesive grain |
For optimal performance, coolant condition should be monitored regularly. As these formulations do not contain antiseptic additives, replacement is recommended every 1 to 6 months, depending on operating conditions and contamination levels.
Contact us today to discuss your wafer slicing or lapping requirements, and let our team help you select the most suitable wire-saw coolant for stable, high-precision cutting performance.
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