LSV - Laser Micromachining

LSV - Laser Micromachining

Category: Laser Micromachining Available
For more information, visit our official website at symtrace.com

Description

SPECIFICATIONS

Minimal Thermal Impact
Deep-UV laser ablation produces virtually no heat-affected zone (HAZ), debris, or oxides.

Precision Material Removal
Flat, uniform beam removes ~1/3 µm per shot with depth control down to 100 nm.

High Accuracy & Repeatability
Confocal setup and sub-micron positioning enable micron-level ablation precision.

Adaptive Energy Control
Continuously variable demagnification optics increase energy density for challenging materials.

User-Friendly Operation
Software routines simplify recipe development, autofocus, and live video monitoring.

Advanced System Integration
Air-cooled excimer laser, pneumatic rotary chuck, mask-projection ablation, fume extraction, and Class 1 safety enclosure ensure safe, reliable operation.


 

More detail about SYMTRACE MASCHINEN SDN BHD
SYMTRACE MASCHINEN SDN BHD
SYMTRACE MASCHINEN SDN BHD SYMTRACE MASCHINEN SDN BHD | Industrial Laser Specialist, Laser Marking Machine Distributor, Laser Coder Supplier in Malaysia
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