The EX-Z13FB-R is part of the EX-Z series, which utilises new semiconductor packaging technology that does not use wire bonding to produce one of the thinnest packages available. The small unit size allows installation of sensors in a narrow space where only a conventional fibre sensor head could be installed before. The built-in amplifier also saves on installation space
Ultra minute
Built in amplifier
Small object sensing capability
Suitable for a wide range of applications
Malaysia
