74LS28

Category: Elec-component Available (Qty:9999999)
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Description

BUY 74LS28 https://www.utsource.net/itm/p/98309.html
QUAD 2-INPUT NOR BUFFER

Parameter Description Value Unit
Power Supply Voltage (VCC) Operating voltage range 4.75 to 5.25 V
Output High Level Voltage (VOH) Minimum output high level voltage at IOH = -0.4 mA 2.4 V
Output Low Level Voltage (VOL) Maximum output low level voltage at IOL = 16 mA 0.4 V
Input High Level Voltage (VIH) Minimum input high level voltage 2.0 V
Input Low Level Voltage (VIL) Maximum input low level voltage 0.8 V
Propagation Delay Time (tpd) Typical propagation delay time 9 ns
Power Dissipation (PD) Maximum power dissipation per package 100 mW
Operating Temperature Range (TA) Ambient temperature range for operation 0 to 70 °C
Storage Temperature Range (TSTG) Temperature range for storage -65 to 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the power supply voltage is within the specified range of 4.75V to 5.25V.
    • Connect the VCC pin to the positive supply and GND to the ground.
  2. Input Signals:

    • Apply input signals that meet the VIH and VIL specifications to ensure proper logic levels.
    • Avoid applying voltages outside the VCC range to the inputs to prevent damage.
  3. Output Signals:

    • Ensure that the load connected to the outputs does not exceed the maximum current ratings.
    • Use pull-up or pull-down resistors as needed to maintain stable logic levels.
  4. Propagation Delay:

    • Account for the typical propagation delay of 9 ns when designing timing-sensitive circuits.
  5. Temperature Considerations:

    • Operate the device within the specified ambient temperature range of 0°C to 70°C.
    • Store the device in an environment with temperatures between -65°C and 150°C.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and assembly.
  7. Mounting:

    • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
    • Use appropriate heat sinks if necessary to manage thermal dissipation.
  8. Testing:

    • Test the device under controlled conditions to verify its functionality before integrating it into a larger system.
(For reference only)

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