74 series Digital Integrated Circuits
SN74LS242N
SN74LS242N

 

SN74LS242N

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Category: 74 series Digital Integrated Circuits Available (Qty:9999999)
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Description

BUY SN74LS242N https://www.utsource.net/itm/p/1710471.html
QUADRUPLE BUS TRANSCEIVERS

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC - 4.75 5.0 5.25 V
Input Low Voltage VIL - 0.8 - - V
Input High Voltage VIH - - - 2.0 V
Output Low Voltage VOL IOL = 16 mA - - 0.4 V
Output High Voltage VOH IOH = -0.4 mA 2.7 - - V
Input Leakage Current IIL VCC = 5V, VI = 0V -0.4 - 0.4 mA
Output Low Current IOL VCC = 5V, VOL = 0.4V 8 - 16 mA
Output High Current IOH VCC = 5V, VOH = 2.7V -0.4 - -0.8 mA
Propagation Delay Time tpd VCC = 5V, TA = 25°C - 19 - ns
Power Dissipation PD - - - 100 mW

Instructions for SN74LS242N:

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the range of 4.75V to 5.25V to avoid damage to the device.

  2. Input Levels:

    • For a valid low input (VIL), the voltage should be less than or equal to 0.8V.
    • For a valid high input (VIH), the voltage should be greater than or equal to 2.0V.

  3. Output Levels:

    • When the output is low (VOL), the voltage will not exceed 0.4V when sourcing up to 16mA.
    • When the output is high (VOH), the voltage will be at least 2.7V when sinking up to 0.4mA.

  4. Current Ratings:

    • The maximum current that can be sourced by an output (IOL) is 16mA.
    • The maximum current that can be sunk by an output (IOH) is 0.8mA.

  5. Propagation Delay:

    • The propagation delay time (tpd) is typically 19ns at room temperature (25°C) and a supply voltage of 5V.

  6. Power Dissipation:

    • The maximum power dissipation (PD) for the device is 100mW.

  7. Handling:

    • Handle the device with care to avoid static discharge which can damage the internal circuits.
    • Use appropriate ESD protection measures during handling and installation.

  8. Mounting:

    • Ensure proper mounting and soldering techniques to avoid thermal stress and mechanical damage.
    • Follow the recommended PCB layout guidelines for optimal performance and reliability.

  9. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Keep the device in its original packaging until ready for use.

  10. Testing:

    • Before integrating the device into a circuit, test it using the specified conditions to ensure it meets the required specifications.
(For reference only)

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