BESTEM-D10SP

CANON / NEC Bestem D10SP is a die attach machine designed for the assembly of semiconductor devices. It is designed to offer higher performance and accuracy due to its advanced features. The D10SP can handle a variety of die sizes and shapes, including round and square varieties, for component die bonding production. The D10SP is capable of automatically counting die and determines the die size before loading into the machine for attachment. The digital camera has a high-quality imaging system to capture clear images of the component and terminals. Additionally, the machine is configured with digital force control and precision capstans to ensure precise and reliable bonding of the component dies. NEC Bestem D10SP has a closed loop high-speed servo motor assembly platform with a speed range of 500-1200RPM, ensuring high throughput and accuracy.