Accelerate your hardware development with our 181mm x 85mm Universal Prototype PCB Board. This elongated dot-matrix board is an essential tool for engineers, students, and makers, providing a reliable platform for permanent circuit assembly and hardware testing in slim enclosures. Designed with a high-density grid of pre-drilled, tinned holes, this board supports a wide range of through-hole components for clean and professional results.
Optimized Elongated Dimensions: The 181mm x 85mm footprint offers a unique workspace ideal for complex circuit designs that require a long, narrow form factor.
Double-Sided Connectivity: Features tinned copper pads on both surfaces, enabling complex routing and component mounting on either side of the board.
Integrated Edge Connectors: Includes specialized contact pads along the top and bottom edges, perfect for power distribution or interfacing with external bus systems.
Precision Coordinate System: Clearly labeled alphanumeric markings facilitate accurate component placement and rapid circuit mapping across the large surface area.
Robust Substrate Material: Manufactured from high-quality heat-resistant material to prevent pad lifting and warping during intensive soldering sessions.
The BNK-08 Series prototype board is specifically built to bridge the gap between temporary breadboarding and custom manufactured PCBs. Its sturdy construction and high-quality tinned finish ensure long-lasting durability for industrial controls, custom laboratory tools, and sophisticated DIY electronics projects.
Dimensions: 181mm x 85mm.
Is the hole spacing compatible with standard components?
Yes, this board features standard pitch spacing (2.54mm/0.1"), making it perfectly compatible with most ICs, headers, and discrete electronic components.
Can I use this for high-component density projects?
Absolutely. The double-sided tinned pads and generous 181mm length provide ample room for intricate wiring and high component counts.
How durable are the solder pads?
The pads are high-quality tinned copper, designed to withstand the heat of professional soldering without delaminating from the substrate.
