MULTI TEMPERATURE GRADE TWO PART EPOXY SEGMENTAL BRIDGE ADHESIVE
Description
X-TITE® SBA MT Segmental Bridge Adhesive is a high build, solvent free thixotropic epoxy resin specifically developed for use as an adhesive for precast segmental bridge elements. It is suitable for use at different temperatures (mixed product) range of 20C to 40C and can be applied in ambient temperatures from 5C to 40C. A FAST SET hardener is available for lower temperatures with shorter pot life and open time. A SLOW SET hardener is available for high ambient temperatures with longer pot life and open time. SLOW SET hardener can also be used for large segments when extended pot life and open time is required.
Important Note:
The products are formulated to be used at a temperature of ±5C on the temperature of mixed material shown above without any loss of performance. The only effect will be a change in pot life and open time which the installer will accommodate in their method of working.
Advantages
Can be applied over a wide temperature range
Non slump
Non shrink
Primerless
High strength and high modulus
Single face application
Easy to pour hardener component
Can be applied to damp substrates and during light showers
Limitation
Do not part mix packs
Do not leave in the pail once mixing is completed
Do not add fillers or solvents
Do not apply below 5C
Avoid excessive application
Avoid skin contact
Do not dispose unmixed components into landfill or water
Packaging
3.4 Liter (5kg) / Tin
Malaysia
