Elec-component
TC4427COA.
TC4427COA.

 

TC4427COA.

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Deskripsi

BUY TC4427COA. https://www.utsource.net/itm/p/12610383.html

Parameter Symbol Min Typical Max Unit Conditions
Supply Voltage VCC 4.5 - 18 V Operating Range
Quiescent Current IQ - 60 100 μA VCC = 15V, TA = 25°C
Input High Voltage VIH 2.0 - - V VCC = 4.5V to 18V
Input Low Voltage VIL - 0.8 1.5 V VCC = 4.5V to 18V
Propagation Delay Time td - 35 60 ns VCC = 15V, TA = 25°C, VO = 15V, CL = 100pF
Rise Time tr - 12 20 ns VCC = 15V, TA = 25°C, VO = 15V, CL = 100pF
Fall Time tf - 12 20 ns VCC = 15V, TA = 25°C, VO = 15V, CL = 100pF
Output High Voltage VOH 13.5 - 15 V VCC = 15V, IO = -10mA, TA = 25°C
Output Low Voltage VOL 0 - 0.4 V VCC = 15V, IO = 10mA, TA = 25°C
Output Current (Sink) IOS - - 250 mA VCC = 15V, TA = 25°C
Output Current (Source) IOL - - 250 mA VCC = 15V, TA = 25°C
Operating Temperature TA -40 - 125 °C Storage and Operation
Storage Temperature TSTG -65 - 150 °C -

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the operating range of 4.5V to 18V.
    • Use a stable power source to avoid voltage fluctuations that can affect performance.

  2. Input Signal:

    • The input signal should be within the specified high (VIH) and low (VIL) voltage levels to ensure proper switching.
    • Avoid input voltages outside the specified range to prevent damage or incorrect operation.

  3. Output Load:

    • The output can sink or source up to 250mA. Ensure the load does not exceed this current limit.
    • For optimal performance, keep the load capacitance (CL) at or below 100pF to minimize rise and fall times.

  4. Temperature Considerations:

    • The device is designed to operate over a wide temperature range (-40°C to 125°C). Ensure the ambient temperature is within these limits.
    • Store the device in an environment where the temperature does not exceed the storage temperature range (-65°C to 150°C).

  5. Propagation Delay:

    • The propagation delay time (td) is crucial for timing-sensitive applications. Ensure that the delay is accounted for in your design.

  6. Mounting and Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow standard PCB mounting procedures to ensure reliable connections and performance.

  7. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications and performance criteria.

  8. Documentation:

    • Refer to the datasheet and application notes for more detailed information and specific use cases.
(For reference only)

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