HD74HC4060P

HD74HC4060P

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Deskripsi

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COUNTER|UP|14-BIT BINARY|HC-CMOS|DIP|16PIN|PLASTIC

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC - 2.0 5.0 6.0 V
Output Voltage (High Level) VOH IO = -1.0 mA, VCC = 4.5 V to 5.5 V - 2.4 5.0 V
Output Voltage (Low Level) VOL IO = 1.6 mA, VCC = 4.5 V to 5.5 V 0.0 0.1 - V
Input Voltage (High Level) VIH - 3.15 - VCC V
Input Voltage (Low Level) VIL - - 0.8 - V
Propagation Delay Time tpd fo = 1 MHz, VCC = 4.5 V to 5.5 V - 40 70 ns
Power Dissipation PD - - - 100 mW
Operating Temperature Range TA - -40 - 85 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0 V to 6.0 V. The typical operating voltage is 5.0 V.
  2. Output Voltage:

    • The output voltage high level (VOH) should be at least 2.4 V when the supply voltage is between 4.5 V and 5.5 V.
    • The output voltage low level (VOL) should not exceed 0.1 V under the same conditions.
  3. Input Voltage:

    • The input voltage high level (VIH) must be at least 3.15 V or up to the supply voltage.
    • The input voltage low level (VIL) must be no more than 0.8 V.
  4. Propagation Delay Time (tpd):

    • The propagation delay time is typically 40 ns and can go up to 70 ns at a frequency of 1 MHz and a supply voltage of 4.5 V to 5.5 V.
  5. Power Dissipation (PD):

    • The maximum power dissipation is 100 mW. Ensure adequate heat dissipation if operating near this limit.
  6. Operating Temperature (TA):

    • The device is designed to operate within a temperature range of -40°C to 85°C.
  7. Storage Temperature (TSTG):

    • Store the device in a temperature range of -65°C to 150°C.
  8. Handling and Storage:

    • Handle with care to avoid static damage. Store in a dry, cool place to prevent moisture damage.
  9. Circuit Design:

    • Ensure proper decoupling capacitors are used near the power supply pins to reduce noise and improve stability.
  10. Testing:

    • When testing, use appropriate test equipment and ensure all connections are secure and correct to avoid damage to the device.

For detailed application notes and further information, refer to the datasheet provided by the manufacturer.

(For reference only)

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