74HCT125

74HCT125

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Deskripsi

BUY 74HCT125 https://www.utsource.net/itm/p/1149613.html
Quad buffer/line driver;3-state/

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 2.0 - 6.0 V
Input Low Voltage VIL - 0.8 1.5 V VCC = 4.5V to 5.5V
Input High Voltage VIH 2.0 3.5 - V VCC = 4.5V to 5.5V
Output Low Voltage VOL 0.0 0.1 0.4 V IOL = 4mA
Output High Voltage VOH 2.4 3.6 5.0 V IOH = -0.4mA
Input Leakage Current IIL - 1.0 20 μA VIN = 0V
Output Leakage Current IOL - 0.1 0.4 μA VOUT = 0V
Propagation Delay Time tpd 6 - 18 ns VCC = 5V, VIN = 0V to 5V
Power Dissipation PD - - 100 mW Per Gate
Operating Temperature Range TA -40 - 85 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
    • Connect the ground (GND) pin to a stable reference point.
  2. Input Signals:

    • Apply input signals that meet the specified input low (VIL) and input high (VIH) voltage levels.
    • Ensure input signals do not exceed the supply voltage (VCC).
  3. Output Signals:

    • The output signals will be driven to either the output low (VOL) or output high (VOH) voltage levels based on the input signal.
    • Ensure the load connected to the output does not exceed the maximum current ratings (IOL and IOH).
  4. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for the output to respond to a change in the input signal. This should be considered when designing timing-sensitive circuits.
  5. Temperature Considerations:

    • The device is designed to operate over a temperature range of -40°C to 85°C. Ensure the operating environment does not exceed these limits.
  6. Power Dissipation:

    • Each gate has a maximum power dissipation of 100mW. Design the circuit to ensure this limit is not exceeded, especially in high-frequency applications.
  7. Handling Precautions:

    • The 74HCT125 is sensitive to electrostatic discharge (ESD). Handle the device with appropriate ESD protection measures.
    • Avoid applying excessive voltage or current to any pin to prevent damage to the device.
  8. Storage and Packaging:

    • Store the device in a dry, cool place away from direct sunlight.
    • Follow recommended storage and handling guidelines to maintain the integrity of the device.
(For reference only)

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