74 series Digital Integrated Circuits
SN74LS113AN
SN74LS113AN

 

SN74LS113AN

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Deskripsi

BUY SN74LS113AN https://www.utsource.net/itm/p/1887199.html
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET

Parameter Symbol Conditions Min Typical Max Unit
Supply Voltage VCC Operating 4.75 - 5.25 V
Input High Voltage VIH IIN = -0.5 mA 2.0 - - V
Input Low Voltage VIL IIN = 0.5 mA - - 0.8 V
Output High Voltage VOH IOL = -0.4 mA 2.4 - - V
Output Low Voltage VOL IOL = 16 mA - - 0.5 V
Propagation Delay Time tpd VCC = 5V - 22 34 ns
Power Dissipation PD Per Package - - 500 mW
Operating Temperature Range TA Commercial 0 - 70 °C
Storage Temperature Range TSTG -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 4.75V to 5.25V.
    • Connect the ground (GND) pin to a stable 0V reference.

  2. Input Signals:

    • For a valid high input (VIH), the voltage should be at least 2.0V.
    • For a valid low input (VIL), the voltage should not exceed 0.8V.
    • Avoid floating inputs; use pull-up or pull-down resistors as necessary.

  3. Output Signals:

    • The output high voltage (VOH) should be at least 2.4V when sourcing current up to -0.4 mA.
    • The output low voltage (VOL) should not exceed 0.5V when sinking current up to 16 mA.

  4. Propagation Delay:

    • The typical propagation delay time (tpd) is 22 ns with a maximum of 34 ns at VCC = 5V.

  5. Power Dissipation:

    • Ensure that the total power dissipation (PD) does not exceed 500 mW to avoid overheating.

  6. Temperature:

    • Operate the device within the commercial temperature range of 0°C to 70°C.
    • Store the device within the storage temperature range of -65°C to 150°C.

  7. Handling:

    • Handle the device with care to avoid electrostatic discharge (ESD) damage.
    • Follow standard ESD protection procedures during handling and assembly.

  8. Mounting:

    • Ensure proper mechanical mounting to maintain electrical performance and thermal management.
    • Use appropriate soldering techniques and temperatures to avoid damage to the device.
(For reference only)

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