Nano Indenter G200X
Precise mechanical testing for micro-to-nano range of loads and displacements. The G200X measures Young's modulus and hardness, including measurement of deformation over six orders of magnitude, from nanometers to millimeters. The system can also measure the complex modulus of polymers, gels and biological tissue, as well as the creep response of thin metallic films.
Product Overview
The G200X is powered by electromagnetic transducers to deliver precise, reliable measurements at the nanoscale level. The system provides accurate sample positioning, easy sample viewing, and simple sample height adjustment. Depending on the configuration, the G200X utilizes either the InForce 1000 or InForce 50 indentation head, and a modular controller that allows users to add capabilities as needed. The system has a small footprint to conserve lab space and conforms to ISO 14577. The proprietary InView software suite includes RunTest with on-screen controls, ReviewData for data analysis, and InFocus for generating graphs and reports.
Main Features & Capabilities
Multi-Mode Platform
Upgradeable platform for nanomechanical property measurement, scanning probe microscopy, high-temperature testing and conductive nanoindentation with statistical data analysis.
Continuous Stiffness Measurement
Measures stiffness and other material properties during the indentation cycle. Oscillates the probe to measure properties as a function of depth, force, time, or frequency.
NanoBlitz 3D Mapping
Quickly and quantitatively maps surface mechanical properties by generating thousands of data points in minutes, assessing differences in microstructure and property gradients.
Scratch and Wear Testing
Applies a constant or ramped load to an indenter tip as it moves across the sample surface for analysis of thin film delamination, brittle ceramics and polymers.
AccuFilm Thin Film Method
Characterizes ultra-thin films by correcting for substrate influence using the Hay-Crawford model, enabling measurement of hard films on soft substrates and vice versa.
ProbeDMA Local DMA
Enables dynamic mechanical analyses on soft polymers and other materials by measuring storage modulus, loss modulus, and loss factor as a function of frequency.
Description & Key Benefits
Versatile Applications
Hard Coatings
Characterization of thin film hardness, modulus, and adhesion for protective and functional coating development.
Biomaterials & Tissue
Measurement of complex modulus of biomaterials, biological and artificial tissue with shear moduli on the order of 1 kPa.
Ceramics
Fracture toughness, hardness, and modulus evaluation of advanced ceramics for structural and engineering applications.
Semiconductors
Nanomechanical characterization of wafer-level materials, thin films, and interconnect structures for process control.
Metals
Creep response, strain rate sensitivity, and hardness testing of metallic thin films and bulk microstructures.
