ADG508AKRZ SOP16

ADG508AKRZ SOP16

Category: Available (Qty:9999999)
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Description

BUY ADG508AKRZ SOP16 https://www.utsource.net/itm/p/9272527.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD - 4.5 - 36 V
Supply Current (Quiescent) IQ All switches off, VDD = 5V - 25 - μA
On-State Resistance RON VDD = 5V, VGS = 5V 1.2 - 2.0 Ω
Off-State Leakage Current IOFF VDD = 5V, VGS = 0V - - 1 nA
Switching Time (On) tON VDD = 5V, VGS = 5V - 10 - ns
Switching Time (Off) tOFF VDD = 5V, VGS = 0V - 10 - ns
Input Signal Range VIN - -0.3 - VDD + 0.3 V
Operating Temperature TA - -40 - 85 °C
Storage Temperature TSTG - -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 4.5V to 36V.
    • Connect the supply voltage to the VDD pin and ground to the GND pin.
  2. Signal Input:

    • The input signal (VIN) should be within the range of -0.3V to VDD + 0.3V to avoid damage to the device.
  3. Control Signals:

    • Use the control signals (S1-S8) to enable or disable the corresponding switches. Apply a high logic level (VDD) to turn on a switch and a low logic level (GND) to turn it off.
  4. Quiescent Current:

    • When all switches are off, the quiescent current (IQ) is typically 25μA at VDD = 5V.
  5. Switch Performance:

    • The on-state resistance (RON) is typically 1.2Ω to 2.0Ω at VDD = 5V.
    • The off-state leakage current (IOFF) is typically less than 1nA at VDD = 5V.
  6. Switching Times:

    • The typical switching times (tON and tOFF) are 10ns at VDD = 5V.
  7. Temperature Considerations:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  8. Handling and Storage:

    • Store the device in a dry environment to prevent moisture damage.
    • Handle the device with care to avoid static discharge, which can damage the internal components.
  9. Mounting:

    • Solder the device onto the PCB following standard surface mount technology (SMT) procedures.
    • Ensure proper thermal management if the device will be operating at high temperatures or under high load conditions.
(For reference only)

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