ADUM1201ARZ-RL7 Z SOP8: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Description	Min	Typ	Max	Unit
Isolation Voltage	Minimum isolation voltage between input and output	-	2500	-	Vrms
Working Voltage	Maximum continuous working voltage between input and output	-	560	-	Vdc
Insulation Withstand Voltage	Minimum insulation withstand voltage for 1 second	-	3750	-	Vpk
Input Voltage (VIH)	High-level input voltage	2.0	-	5.5	V
Input Voltage (VIL)	Low-level input voltage	0	-	0.8	V
Output Voltage (VOH)	High-level output voltage	2.4	-	5.5	V
Output Voltage (VOL)	Low-level output voltage	0	-	0.4	V
Propagation Delay (tPD)	Time delay from input to output	9	-	15	ns
Propagation Delay Skew (tPSK)	Maximum difference in propagation delay between channels	-	-	5	ns
Common Mode Transient Immunity (CMTI)	Ability to reject common mode transients	-	25	-	kV/μs
Operating Temperature	Range of ambient operating temperatures	-40	-	125	°C
Storage Temperature	Range of storage temperatures	-65	-	150	°C
Supply Current (ICC)	Quiescent current per channel	1.0	-	1.5	mA
Channel-to-Channel Capacitance	Capacitance between isolated channels	-	-	2.0	pF

Power Supply:
- Ensure the supply voltage is within the specified range (2.7V to 5.5V).
- Connect the power supply to both the input and output sides if using dual power supplies.
Signal Levels:
- Input signals should be within the VIH and VIL specifications.
- Output signals will be within the VOH and VOL specifications.
Isolation:
- Ensure that the working voltage does not exceed 560Vdc.
- For safety, do not exceed the insulation withstand voltage of 3750Vpk for more than 1 second.
Timing:
- Account for the propagation delay (tPD) and skew (tPSK) in your system design to ensure proper timing.
Environmental Conditions:
- Operate the device within the specified temperature ranges to avoid damage or performance degradation.
Handling:
- Handle with care to avoid mechanical stress on the package.
- Follow ESD (Electrostatic Discharge) precautions to prevent damage.
Mounting:
- Ensure proper soldering and mounting to avoid thermal issues and mechanical stress.
- Use recommended PCB layout guidelines for optimal performance and reliability.
Testing:
- Perform functional tests to verify correct operation after assembly.
- Test for CMTI and other electrical characteristics as needed.

For detailed application notes and further information, refer to the datasheet provided by Analog Devices.

(For reference only)